PDP Micro Dicing Services provides Sawing Services to the microelectronic and the optical industry. Our specialty is in processing hard to cut and brittle materials. We offer a full in-house production and research facility. Our core expertise in Dicing, Cutting and Sawing services offers you a complete solution for your R&D and production needs. We can produce custom blades for dicing your specific materials. Our fulltime staff includes a Ph. D. and engineers with years of experience in the handling of various materials.
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SCOPE OF OFFERINGS:
- Precision Dicing and Sawing
- Dicing Consultation
- Pick and Place Service
- Thinning, Grinding and Polishing
- Custom Dicing Blades
- Quick Turnaround Services
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MATERIALS THAT WE PROCESS: (partial list)
- IC - Silicon, Gallium Arsenide, MEMS, LED
- Glass and Ceramics - Quartz, Pyrex, SiC, TiC, PZT, Alumina
- Crystals - Sapphire, Ruby, YAG, Zirconia, Lithium Niobate, Lithium Tantalate, Garnet
- Substrates - Solar Cells, Multi-layer Boards, FR4, Plastic, bonded materials
- Metals - Ag, Al, Cu, W, Mo, Kovar
- Shapes - Tubes, Coils, Cylinders
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_________________________________________________________________ 1111 Elko Dr. Bldg H, Sunnyvale, CA 94089 Tel: (408) 734-8779 Fax: (408) 734-8966
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