Micro Dicing Technology provides Dicing Services to the microelectronic and the optical industry.  We specialize in hard to cut and brittle materials.  Micro Dicing Technology has an in-house production and research facility.  Our core expertise in Dicing, Cutting and Sawing services offers you the complete dicing service solutions for your R&D and production needs.  We can produce custom blades for the dicing your specific materials.  Our fulltime staff includes a Ph. D. and engineers with years of experience in the handling of various materials.

SCOPE OF OFFERINGS:

• Precision Dicing and Sawing
• Dicing Consultation
• Pick and Place Service
• Thinning, Grinding and Polishing
• Custom Dicing Blades
• Quick Turnaround Services

MATERIALS THAT WE PROCESS: (partial list)

• IC - Silicon, Gallium Arsenide, MEMS, LED
• Glass and Ceramics - Quartz, Pyrex, SiC, TiC, PZT, Alumina
• Crystals - Sapphire, Ruby, YAG, Zirconia, Lithium Niobate, Lithium Tantalate, Garnet
• Substrates - Multi-layer Boards, FR4, Plastic, bonded materials
• Metals - Ag, Al, Cu, W, Mo, Kovar
• Shapes - Tubes, Coils, Cylinders

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1111 Elko Dr. Bldg H, Sunnyvale, CA 94089  Tel: (408) 734-8779  Fax: (408) 734-8966