| About Us:
Micro Dicing Technology has been in business for over 15 years. The company was founded in 1989 to support the dicing needs of the growing microelectric industry. We are located in Sunnyvale California in the heart of Silicon Valley.
Micro Dicing Technology specializes in the precision cutting of all materials. Listed below is a brief list of some of the requirements that our services have provided:
- Dicing accuracy within a tolerance of +/- 2 microns
- Dicing width/kerf of 19 microns
- Dicing depth of 3.8 millimeters
- Dicing and Pick and Place service of GaAs die less than 50 microns thick
- Partial dicing grooves with "V" or "U" shapes
- Dicing of "Tubes" and "Coils"
- Creation of custom blades for special tolerance requirements
- Low water exposure dicing process
We have partnerships with local suppliers in various steps of production before and after the dicing process. Micro Dicing Technology can offer you a one stop solution for your production needs.
Micro Dicing Technology's focus is on consistent quality and service for your Dicing, Sawing and Cutting needs. We currently support the dicing needs of over 200 companies and research and development facilities. We support both domestic and international customers. |
